Typically high number of voids cause a large non conductive area
Very low number of voids, Typically < 2 % leads to best Thermal Conduction
1. Void Less
Void reduction between the joining partner (<2%) for better heat transfer . (depending on the device surface quality and selection of process gas). below ordinary conditions void of more than 30% , increase bonding strength.
2. Excellent Temperature Control
latest PLC archtecture and MFC for precision gas flow control , make temperature consistency and precision temperature control .have a good protection .
Water Cooling system : water cooling tank and cross cooling tube ensure it can cooling rapidly in high temperature environment.
3.Very Short Soldering Times
Cycle time is short. welding cycle time about 10 min 。(380-450 ℃ soldering temperature, ooling temperature to 45 ℃。 nitrogen filling, welding vacuum degree is lower than 5*10ˉ¹Pa ), shorter than the other equipment;
4. Variation Process gas
Standard : vacuum chamber filling the 100% nitrogen .
Option : 100% hydrogen, N2 & H2 forming gas , HCOOH, ArH2 Plasma process gas
5. Good human-machine interface
The Windows operating system, provide programming, system status query, system debugging/set, alarm indicator and such as user interface, programming is simple & easy use
6. Advanced PLC and Safety System :
PLC system prevent accidental eg : Hydrogen leakage .
Ultra high temperature alarm, excessive temperature raising alarm
Cooling water pressure detection system, low pressure alarm
HCOOH tank protective cover to prevent accidental explosion of HCOOH tank
Formic acid, hydrogen gas leak detection alarm system
Safety system of automatic pressure relief if over pressure
Hydraulic pallet -- so as to avoid causing water to undertake circuit damage
Automatic hydrogen burning function, Avoiding hydrogen pollution.