Features :
As the single module module concept, can according to production capacity of flexible placement machine production line.
13200 CPH: chip (laser identification/actual production efficiency)
laser stickers picking suction nozzle (4)
0603 (0201) inch chip ~ 20 mm square element, or 26.5 x 11 mm
0402 (01005) inch chip for factory option
Substrate size : 4 kinds of specifications size : 330 * 250 mm / 410 * 360 mm / 510 * 360 mm /510* 460 mm
Element size laser identification (0201) inch chip 0603 ~ 20 mm square components or 26.5 x 11 mm (0402 (01005) inch chip need option) * 2
Components SMT speed chip components CPH * 1 13200
Component placement accuracy laser identification of + / - 0.05 mm
Actual efficiency: chip placement speed is in M size substrate finishing pasted on 400 1608 scale values of components.