1. Image recognition of laser
2. SMT efficiency increased by 20%, * 1 make economic benefits at the same time, operating performance, reliability of a higher level of high-speed modular SMT machine.
3 40000 CPH (best conditions) (0.09 seconds/chip) * 2 30000 CPH (IPC9850) * 2
4 laser head suction nozzle (12)
5. the element size 0402 (01005) inch chip ~ 33.5 mm square elements
1. Substrate size L substrates (410 x 360 mm)
2. Component height of 6 mm specification
3. The element size 0402 (01005) inch chip ~ 33.5 mm components
4. Components SMT chip speed precision components best conditions 0.09 seconds/chip (40000 CPH) IPC9850 40000 CPH component placement speed (chip components) + / - 0.05 mm
5. Components SMT type (converted to 8 mm band) up to 80 kinds